Bare copper wire99.99%

1. main joint material for semiconductor packaging. 2. Bare copper 99.99% 3. Single crystal copper 4. Certification

Copper bonding wire is a kind of material for inner lead with excellent electrical, thermal, mechanical properties and excellent chemical stability, mainly for ket materials of semiconductor packaging( molding compound, solder ball, high-density packaging substrate, conducting resin).

Features of products:

 1. material costs: low

 2. electronical conductivity: 5.88 10E7/Ohm

 3. thermal conductivity: 39.5KW/m2k 

 4. mechanical properties: good

 5. stability: stable

 6. solder joint: relatively better

Diameter(mm)

0.018

0.020

0.023

0.025

0.028

0.030

0.032

0.033

0.038

0.050

special order avaliable

Bare copper wire99.99%