Gold bonding wire for LED packing and IC packing

1. Gold bonding wire 2. High quality 3. Good price 4. Advanced tech manufacture 5. Certification: ISO,ROHS,MSDS,Reach

Gold bonding wire is a kind of material for inner lead with excellent electrical conductivity, mechanical properties, curvature, breaking force and excellent chemical stability. It functions primarily as a connecting material for chip and external circuit, widely used in LED packaging and other microelectronics industries.

Type&For use:

         JC2:TO, SOT, SOP, DIP, LED

         JC5:SOP,DIP,QFP.Diode,Triode

         JE1:QFP, BGA, Ultrafine spacing welding

Features of products:

 1. high purity:Au 99.99%

 2.diameter:

mm	0.014	0.015	0.016	0.017	0.018	0.019	0.02	0.023	0.024	0.025	0.028	0.03	0.032	0.033	0.038
mil	0.05	0.6	0.6	0.65	0.7	0.75	0.8	0.9	0.95	1	1.1	1.2	1.25	1.3	1.4

special order avaliable  

3.elongation:2%-14%

 4. advanced production and testing equipment

 5. strict quality control

 6. fine after-sale service

Gold Wire Mechanical Properties:

Diameter		Elongation	Breaking load
Mm	Mil	%	JC1 JC2	JC3 JC5	JE1 JE2
14±1	0.55	2.0-5.0	>2.5	-	-
15±1	0.6	2.0-5.0	>2.5	-	-
16±1	0.6	2.0-5.0	>3.0	-	-
17±1	0.65	2.0-5.0	>3.5	-	-
18±1	0.7	2.0-5.0	>2.5	>4.0	>5.0
19±1	0.75	2.0-6.0	>3.0	>4.5	>5.5
20±1	0.8	2.0-6.0	>4.0	>5.0	>6.0
23±1	0.9	2.0-7.0	>5.0	>7.0	>8.0
24±1	0.994	2.0-7.0	>6.0	>7.5	>8.5
25±1	1.0	2.0-8.0	>7.0	>9.0	>10.0
28±1	1.1	2.0-8.0	>9.0	>12.0	>13.0
30±1	1.2	3.0-8.0	>11.0	>13.0	>15.0
32±1	1.25	3.0-8.0	>12.0	>15.0	>16.0
33±1	1.3	3.0-8.0	>13.0	>16.0	>18.0
35±1	1.4	3.0-10.0	>15.0	>18.0	>20.0
38±1	1.5	3.0-10.0	>18.0	>21.0	>22.0
40±1	1.6	3.0-10.0	>20.0	>24.0	>26.0
45±1	1.8	3.0-12.0	>25.0	>28.0	>30.0
50±2	2.0	3.0-12.0	>30.0	>34.0	>36.0
60±3	2.4	7.0-14.0	>45.0	>50.0	>52.0
70±3	2.8	7.0-14.0	>55.0	>60.0	>63.0
75±3	3.0	7.0-14.0	>65.0	>65.0	>68.0

Gold bonding wire for LED packing and IC packing