Pure LED encapsulation silver bonding wire

1.main joint material for semiconductor packaging 2. high purity 3. different wire diameters 4.inert gas protection

Silver bonding wire is a new type of inner lead material launched by us to meet market demand. It's superior feature will makes it possible to take the place of gold bonding wire in this compatative packaging industry.

Features of products:

 1. lower cost

 2. high mechanical property

 3. fine electronical conductivity

 4. high elongation

Diamter(mm)

0.018

0.020

0.023

0.025

special order avaliable

Mechanical properties:

Diameter		Weight	Elongation	Breaking load
μm	Mil	Mg/20cm	%	cn
18+1	0.7	0.477-0.595	≥6	≥4
20+1	0.8	0.595-0.727	≥6	≥5
23+1	0.9	0.798-0.95	≥8	≥7
25+1	1	0.95-1.115	≥9	≥8

Double flange spool:

Spool  type	Material	Flange  diameter	Core  diameter	Wall  thickness	Internal  diameter	Overall  width	Width over windings
AL-2	Aluminum	mm	mm	mm	mm	mm	mm
		Φ58.5±1.0	Φ50.3±0.01	Φ0.75±0.1	Φ48.8±0.2	Φ28±0.5	Φ26.5±0.5
AL-4		Φ58.5±1.0	Φ50.3±0.01	Φ0.75±0.1	Φ48.8±0.2	Φ47.3±0.5	Φ45.5±0.5

Pure LED encapsulation silver bonding wire