Bare and palladium LED encapsulation copper bonding wire

1.Main joint material for semiconductor packaging 2.Bare and palladium 3.Different wire diameters 4.Inert gas protection

Copper bonding wire is a kind of material for inner lead with excellent electrical, thermal, mechanical properties and excellent chemical stability, mainly for ket materials of semiconductor packaging( molding compound, solder ball, high-density packaging substrate, conducting resin).

Product Advantage

   

1. Material costs:low

   

2. Conductivity: much thinner bonding wires during fine pitch packaging, excellent performance of fine pitch

                         (much smaller bonding pad), improving current capacity and property of power regulating        

                          device.

  

3. Thermal conductivity: 39.5KW/m2K

  

4. Mechanical properties: high mechanical property, larger tensile strength, better elongation, excellent ball 

                                         collar strength and higher arc stability.

  

5. Stability: stable-slow inter-metallic growth rate, improving mechanical stability and decreasing incremental 

                   resistance: moderate IMCgrowth enables bonding strength to be improved.

  

6. Solder joint: significantly reduced inter-metallic growth rate of solder joints. Resistance reduced, heat 

                         production decreased, bonding reliability devece performance improved. As the new products 

                         have their inter- metallic growth rate, resistance and heat production lower than gold wire, 

                         the amount of resistance increase with time and aging rate also is reduced.

Diameter(mm)

0.018

0.020

0.023

0.025

0.028

0.030

0.032

0.033

0.038

0.050

special order avaliable

Bare and palladium LED encapsulation copper bonding wire